摘要
研究了几种活性剂作用下Sn-0.65Cu/Cu的扩展率及焊点界面金属间化合物(IMC)的形貌,探讨了活性剂的活性强弱与IMC厚度的关系。结果表明,不同活性剂作用下Sn-0.65Cu/Cu扩展率的大小顺序为:氢化松香>戊二酸>苹果酸>柠檬酸;在活性越强的活性剂作用下,液态钎料在Cu基板上越容易铺展,钎料的温度分布更均匀,加剧了Sn原子和溶解在液态钎料的Cu原子的热运动,Sn原子与Cu原子反应结合的概率增大,导致生成的IMC层更厚。
The spread rate and the morphology of the intermetallic compounds （IMC） in Sn-0.65Cu solder were studied under several kinds of activators. The relationship between the activity of activators and the thickness of IMC was discussed. The results have shown that the spread rate followed in a decreasing order： hydrogenated rosin〉glutarie acid〉malic acid〉citric acid. Stronger the activity of activators, better the spreading of solders on the Cu-substrates, and the temperature distributions in molten solder were more evenly, which could resuh in accelerating of the diffusion of Sn atoms and Cu atoms in molten solder. The thickness of 1MC was larger with in- creasing of combining Sn atoms with Cu atoms.
出处
《精密成形工程》
2013年第1期33-36,84,共5页
Journal of Netshape Forming Engineering
