摘要
塑封工艺是微电子封装中的一个重要环节。在塑封工艺中,减少由于设备、环境因素、原辅材料等因素的影响所引起的不良产品的产生对整个封装工程良品率的提高有很大帮助。通过分析几种不良现象的形成原因,给出几种不良品的处理方法。
Plastic packaging technology is an important link in semlconauctor packaging, Under influence of equipments, environmental factors or raw material, defective products are always appeared in Plastic packaging technology. Reduce the defects is of great help to improve yield. This paper mainly analyses the reasons for the formation of defects and will find the effective treatments.
出处
《微处理机》
2012年第6期1-3,共3页
Microprocessors
关键词
塑封
不良品
处理
Plastic packaging
Defective products
Treatment
