基于LTCC多层基板技术的宽带T/R组件设计

Design of Broadband T/R Module Based on LTCC Multi-layer Substrate Technology

介绍了一种基于低温共烧陶瓷(LTCC)多层基板工艺的宽带发射/接收(T/R)组件的设计,详细论述了组件的电路布局和装配工艺,给出了具体的测试数据。T/R组件的体积为65mm×29mm×9mm,连续波输出功率大于25W,均方根移相误差小于3°,已达到工程应用要求。

This paper introduces the design of a b based on low temperature co-fire ceramic （LTCC） cuit layout and assembly technics of the module, roadband transmitting/receiving （T/R） multi-layer substrate technics,discusses presents specific test data. The volume module the cir- of T/R module is 65 mm× 29 mm× 9 mm,the output power of continuous wave is more than 25 W,the phase shift error of root mean square is less than 3°, which satisfies the requirement of engineering application.