某电子设备的热分析

Thermal Analysis of A Certain Electronic Equipment

热设计在电子设备结构设计中是十分重要的环节,对提高电子产品的运行稳定性具有重要的意义。通过Ice-pak软件对某电子设备进行热仿真分析,得到了发热器件的温度分布云图。在此基础上,通过改进方案,将器件最高温度控制在耐受温度以下。利用热仿真软件可以及时发现方案中所存在的问题,在提升设备品质性能的同时,缩短了设备的研发周期。

The thermal design is a very important tache in the structure design of electronic equip- ments,and has important meaning to raise the operation stability of the electronic products. This paper performs the thermal simulation analysis to a certain electronic equipment through Icepak software,fetches the temperature distribution cloud figure of heat devices, based on which, the maximum temperature of devices is controlled below the tolerance temperature through improving program. The usage of thermal simulation software can find the problems in the program, which improves the quality and performance of equipments as well as shortens the development period of equipments at the same time.