半导体工业中的化学机械抛光(CMP)技术

Chemical-Mechanical Polishing Technique in the Semiconductor Industry

介绍了半导体工业中蓬勃发展的化学机械抛光 (CMP)技术。重点叙述了CMP技术所采用的设备及消耗品 ,CMP过程机理 ,抛光片的检测及影响抛光片质量的因素 ,CMP技术的应用及发展趋势。

The Chemical mechanical polishing technique in the field of semiconductor industry was introduced.The introduction mainly focused on the used equipment and consumables used in the CMP technique,the process mechanism,the detecting of the wafer and the factor affecting the wafer quality,the application and development of the CMP technique.