低黏度耐超低温室温固化环氧树脂密封剂

A room temperature-curable epoxy resin sealant with low viscosity and ultra-low temperature-resistance

以四氢邻苯二甲酸二缩水甘油酯[711EP(环氧树脂)]为基体、二乙二醇缩水甘油醚(JX-023)为柔性改性剂和二乙烯三胺(DETA)为固化剂,制备可室温(25℃)固化的高性能EP密封剂,并采用单因素试验法优选出制备EP密封剂的最优配方。研究结果表明:当m(711EP)∶m(JX-023)∶m(DETA)=1∶1∶3时,EP密封剂的室温综合性能相对最好;其低温(-196℃)剪切强度(16.5 MPa)和低温剥离强度(31.2 kN/m)接近于室温性能,同时其耐高低温(-196～100℃)循环性能优异,初始黏度低于0.1 Pa.s;该EP密封剂可用于超低温领域及微小部件的粘接与密封。

With tetrahydrophthalic diglycidyl ester[711 EP （epoxy resin） ] as matrix, diglycol glycidyl ether （JX-023） as flexible modifier and diethylene triamine （DETA） as curing agent, a room temperature （25 ℃ ）-curable EP sealant with high performance was prepared, and the optimal formula of preparing EP sealant was preferred by single-factor experiment method. The research results showed that the EP sealant had the relatively best combination property at room temperature when mass ratio of m （711EP） ：m （JX-023） ：m （DETA） was 1 ： 1：3. Here, its some properties such as shear strength（16.5 Mpa） and peeling strength （31.2 kN/m） at low temperature （-196 ℃） verge on the properties at room temperature,and its high-low temperature-resistance（-196-100 ℃） cycle performance was also excellent,and the initial viscosity was below 0.1 Pa ·s. The EP sealant could be used for ultra-low temperature fields, and could be used as adhesive and sealant of micro-parts.