摘要
本文描述了近年来高密度封装中出现的新技术、新结构,如载带自动键合技术(TAB)、带线四边有引线扁平封装(TQFP)和多芯片模块(MCM)结构等。论述了高密度封装的设计考虑及材料的选择。并且指出,只有低介电常数且制成薄膜的聚酰亚胺介质材料才能提高封装密度。
This paper describes some new techniques and new structures in high density packaging in recent years,e. g.TAB technique and TQFP, MCM structures. It also reviews the design considerations and selection of the packaging materials. The author points out that only the polyimide dielectric material which can be madeinto thin film and has low dielectric constants can enhance the packaging density.
出处
《半导体情报》
1991年第3期26-33,共8页
Semiconductor Information
关键词
集成电路
封装
工艺
High density packaging
Integrated circuit technology
Design
