摘要
采用原位加热还原的工艺将氧化石墨烯/热塑性聚氨酯复合材料进行还原,得到了不同体积分数的热还原石墨烯/热塑性聚氨酯复合材料,并对其热还原温度及压阻特性进行了分析。结果表明:200℃为该复合材料体系适宜的还原温度,在此温度下保持2 h后,氧化石墨烯复合材料的电性能优异,填料分散均匀,其中石墨烯体积分数分别为2.42%与3.58%的复合材料表现出优异的压阻重复性,为制备高性能柔性压阻复合材料提供了一种新途径。
Graphene oxide（GO）/thermoplastic polyurethane（TPU） composites with different volume contents were prepared by in-situ heating reduction process, and the reduction temperature and piezoresistive characteristics of the composites were studied. The results show that 200 ℃ is a suitable reduction temperature for the GO/TPU composites. After exposing the GO/TPU composites at 200 ℃ for 2 h, the composites achieve excellent electrical properties and the conductive graphene is well dispersed. When the graphene volume content is 2.42% and 3.58%, the composites show excellent piezoresistive repeatability, which shows a new approach to prepare high performance soft piezoresistive composites.
出处
《绝缘材料》
CAS
北大核心
2012年第6期1-4,16,共5页
Insulating Materials
基金
国家自然科学基金(51073015)
北京市自然基金(2122040)
关键词
石墨烯
热塑性聚氨酯
原位加热还原工艺
压阻特性
graphene
thermoplastic polyurethane
in-situ heating reduction process
piezoresistive characteristics
