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高亮度LED灯具热界面材料制备及热模拟分析 被引量:1

Preparation of Thermal Interface Materials for High Brightness LED and Thermal Simulation Analysis
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摘要 利用具有优异导热性能的石墨烯制备了石墨烯/硅油热界面复合材料,研究了材料的相关性能,并将其用于高亮度LED路灯上的散热封装,在对其封装散热效果分析时发现,该热界面材料能有效地降低器件界面热阻,改善高亮度LED的散热问题;同时采用有限元模拟软件ANSYS对热界面材料的散热效果进行模拟,为改进LED封装技术提供了依据。 The graphene (GN)/thermal interface material (TIM) with silicone oil (SI) were made by graphene which has good thermal conductivity. Researched the material's properties, and used it in the thermal package of HB-LED lights, to study the thermal package effect of TIM, it was found that the TIM could reduce the interfacial thermal resistance of the device effectively, and improved the HB-LED's heat problem; and simulated HB-LED heat distribution by ANSYS software, which provided the basis for the improvement of LED packaging technology.
出处 《纳米科技》 2012年第6期13-17,75,共6页
基金 国家自然科学基金项目fNo.20971027),高等学校博士学科点专项科研基金项目(No20094420110005)
关键词 热界面材料 石墨烯 导热系数 硅油 LED TIM grapheme thermal conductivity silicon oil LED
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  • 1白坤,聂秋华,吴礼刚,戴世勋,林万炯,周伯友,马湘君,郑兆勇.大功率白光LED灯具散热优化方案[J].照明工程学报,2012,23(2):52-56. 被引量:6
  • 2王耀明,王德苗,苏达.大功率LED的散热封装[J].江南大学学报(自然科学版),2009,8(1):58-61. 被引量:16
  • 3Patrick Mottier. LEDs for lighting applications[M]. ISTE Ltd and John Wiley & Sons, Inc, 2009.
  • 4王静,吴福根.改善大功率LED散热的关键问题[J].电子设计工程,2009,17(4):123-125. 被引量:38
  • 5Xiang You-lu,Tse Chao Hua, Mei Jing-liu,Yuan xi- aCheng. Thermal analysis of loop heat pipe used for high-power LED[J]. Thermochimica Acta, 2009,493: 25-29.
  • 6Bo-Hung Liou, Chih-Ming Chen, Ray-Hua Horng, etc. Improvement of thermal management of high-power GaN-based light-emitting diodes[J]. Microelectronics Reliability, 2012,52:861-865.
  • 7S.V. Garimella, A.S. Fleischer, J.Y. Murthy, A. Ke- shavarzi, etc. Thermal Challenges in Next-Generation Electronic Systems[J]. IEEE Trans. Compon. Packag. Technol, 2008,31:801-815.
  • 8X.C. Tong, Advanced Materials for Thermal Manage- ment of Electronic Packaging[J]. Springer Series in Advance Microelectronics, 2011,30:201-232.
  • 9Tapas Kuilla, Sambhu Bhadra, Dahu Yao, etc. Recent advances in graphene based polymer composites [J]. Progress in Polymer Science, 2010,35:1350-1375.
  • 10Johan Liu, Bruno Michel, Marta Rencz, etc. Recent Progress of Thermal Interface Material Research-An Overview[J]. THERMINIC, 2008,9:156-162.

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