摘要
文章以栅格阵列封装(land grid array,LGA)模型为研究对象,分析了多层封装基板中的同步开关噪声(simultaneous switching noise,SSN)问题。首先利用频域仿真工具PowerSI得到了键合线和信号布线的S参数模型。然后通过在电路仿真工具HSPICE中加载封装结构的S参数模型和驱动器模型来仿真同步开关噪声。最后在设计中选取在多层基板上添加去耦电容的方式来减小同步开关噪声。仿真结果表明,通过在本LGA多层基板设计中添加110pF容值的去耦电容,可以较好地减少同步开关噪声,满足设计要求。
The physical model of one kind of land grid array（LGA） packages is built,and the simultaneous switching noise（SSN） is analyzed according to this LGA multi-layer package substrate.By utilizing the frequency domain simulation tool,Sigrity PowerSI,the s-parameters of signal traces and bonding wires are obtained,which can be used for time domain simulation.Synopsys Hspice tool is used to simulate the simultaneous switching noise by combining the package s-parameters and drive models,and the decoupling capacitors are adopted to reduce the SSN in this design.According to the time domain simulation results,the 110pF decoupling capacitors are better for reducing the simultaneous switching noise and meet the requirement of the design system.
出处
《电子与封装》
2012年第12期1-4,43,共5页
Electronics & Packaging
基金
国家"核高基"重大专项分课题(2009ZX01031-002-002-002)
国家自然科学基金项目(61040032)
江苏省教育厅高校科研成果产业化推进项目(JHZD10-036)
关键词
集成电路封装
栅格阵列封装
电磁建模
同步开关噪声
integrated circuit package
land grid array
electromagnetic modeling
simultaneous switching noise
