Mo-Cu合金的制备及导热模型

Preparation and Thermal Conductivity Models of Mo-Cu Alloy

采用QM-1SP4-CL行星式球磨机将Mo、Cu粉简单混合和机械合金化后进行压片,在1250℃液相烧结1.5h后获得致密的Mo-30Cu合金;添加1.5%硬脂酸作造孔剂的Mo、Cu混合粉压片在1050℃固相烧结1.5h后获得孔隙率为33.186%的Mo-30Cu合金。利用激光热导仪测定所制备的Mo-30Cu合金的热导率。采用Maxwell模型、Hasselman and Johnson模型、单元结构模型和多相系统的传导性计算Mo-30Cu合金的理论热导率值。通过Mo-30Cu合金的热导率实测值与理论值的比较,得出适用于不同工艺状态的Mo-30Cu合金的热导率模型。

Mo and Cu powder were simply mixed or mechanical alloyed by QM-1SP4-CL planet ball milling, then pressed into tables. In order to obtain tight Mo-30Cu alloy, tables were liquid sintered under 1250 ℃ for 1.5 b. Mo-30Cu alloy which contained 33. 186% poriness were obtained, when tables which were pressed by Mo and Cu mixed powder added 1.5% stearic acid had been solid sintered under 1050 ℃ for 1.5 h. Meanwhile, laser thermal conductance instrument was used to test the thermal conductivity of Mo-30Cu alloy. Maxwell model, Hasselman and, Johnson model, structural unit model and the conductivity of the multiphase system were used to calculate theoretical thermal conductivity of Mo-30Cu alloy. In addtion, through the comparison between experimental thermal conductivity and theoretical thermal conductivity of obtained Mo 30Cu alloy, the model of thermal conductivity applied to various process methods were.