摘要
The effects of Hg and Ga on the electrochemical corrosion behaviors of the Mg-2%Hg, Mg-2%Ga and Mg-2%Hg-2%Ga (mass fraction) alloys were investigated by measurements of polarization curves, galvanostatic tests and measurements of electrochemical impedance spectroscopy. Scanning electron microscopy, X-ray diffractometry and energy dispersive spectrometry were employed to characterize the microstructures and the corroded surface of the above alloys. The results demonstrate that the microstructure of the Mg-2%Ga alloy is solid solution and the Mg-2%Hg and Mg-2%Hg-2%Ga alloys have white second-phases at the grain boundaries. The Mg-2%Ga alloy has the worst electrochemical activity and the best corrosion resistance, showing a mean potential of -1.48 V and a corrosion current density of 0.15 mA/cm2. The Mg-2%Hg-2%Ga alloy has the best electrochemical activity and the worst corrosion resistance, showing a mean potential of -1.848 V and a corrosion current density of 2.136 mA/cm2. The activation mechanism of the Mg-Hg-Ga alloy is dissolution-deposition of the Hg and Ga atoms.
采用动电位极化、恒电流和交流阻抗测试方法研究了Hg和Ga元素对Mg2%Hg,Mg2%Ga和Mg2%Hg2%Ga合金电化学腐蚀性能的影响,并用扫描电镜、X射线衍射和能谱分析了上述合金的显微组织和腐蚀表面形貌。结果表明:Mg2%Ga合金是固溶体,Mg-2%Hg和Mg-2%Hg2%Ga合金的晶界有白色第二相。Mg-2%Ga合金的平均电位为1.48V,腐蚀电流密度为0.15mA/cm2,电化学活性差,耐腐蚀性能好。Mg-2%Hg-2%Ga合金的平均电位1.848V,腐蚀电流密度为2.136mA/cm2,电化学活性好,耐腐蚀性能差。MgHgGa合金的活化机制是Hg和Ga原子的溶解沉积。
基金
Project (MKPT-02-18) supported by the National Defense Science and Technology Industry Committee of China
Project (51101171)supported by the National Natural Science Foundation of China