摘要
介绍了 BGA技术的研究现状 ,着重从芯片互连、基板材料及封装设计等方面讨论了该技术的发展前景。
This paper introduces the research status of ball grid array packaging.The special stress is put on chip interconnection,substrate materials and packaging designs.And the future prospect of this technology is also briefly described.
出处
《半导体情报》
2000年第4期18-22,26,共6页
Semiconductor Information
关键词
封装
芯片互连
BGA
Packaging Chip interconnecting Ball grid array
