摘要
采用金相显微镜、扫描电镜等分析手段对硫化后的银基钎料进行研究.结果表明,硫化后钎料自身抗拉强度随着硫化时间的延长明显下降,但降低到一定程度后基本保持不变;钎料的润湿性差异明显,当硫化时间延长到30 min时润湿面积减少近一半,继续延长硫化时间,钎料铺展面积变化不大;钎料硫化后在其表面形成了一层约10μm厚、相对致密的硫化层;Zn,Cu两种元素在硫化层及钎料内部分布相对比较均匀,Ag元素呈阶梯变化,在硫化层内较少,钎料内部明显增多;硫在钎料里面主要以Ag2S,Cu2S,CuS,ZnS形式存在,这几种物质的熔点比较高,与钢基本不润湿,其存在严重影响钎料的焊接工艺性能.
The properties of sulphurized silver based solder were studied by optical microscope,scanning electron microscopy and other analytical tools.The experimental results indicate that the tensile strength of sulphurized filler metal decreased significantly,and then to a certain extent until not varied.The difference of wettability was obvious at different sulphurizing time.The wetting area was reduced by nearly half at the sulphurizing time of 30 min,but the wetting area of brazing filler metal would change little if the sulphurizing time further lasted.Relative dense sulphurized layer was formed on the surface of brazing filler metal and its thickness was about 10 μm.The distribution of Zn and Cu in the sulphurizing layer and the internal brazing filler metal is relatively uniform,while the Ag element is distributed periodically.Sulfur existed in the form of Ag2S,Cu2S,CuS and ZnS in the brazing filler metal.The melting points of Ag2S,Cu2S,CuS and ZnS were relatively high,and their existence would affect the welding properties severely.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2013年第1期77-80,117,共4页
Transactions of The China Welding Institution
基金
洁净钢工艺仿真与连接界面结构及性能表征研究资助项目(2010CB735809)
关键词
硫化
润湿性
抗拉强度
硫化物
sulfurizing
wettability
tensile strength
sulfide