摘要
文中主要介绍了目前国内外软钎焊技术在电子封装与组装中的应用与展望,通过回顾近年来软钎焊技术的发展,分析无铅封装软钎焊钎料合金体系与复合钎料的研究现状,比较电子封装中不同的软钎焊方法,并阐述软钎焊技术对电子封装可靠性的影响。
Current application and prospect of soldering technology in electronic packaging assembly were discussed.The research of leadfree solder and composite solder systems was summarized with the review of recent development in soldering technology field.The comparison of different soldering methods and their effect on packaging reliability were also analyzed.
出处
《焊接》
北大核心
2013年第1期11-17,69,共7页
Welding & Joining
基金
国家自然科学基金项目(51105107
51021002
51275135)
黑龙江省自然科学基金项目(QC2011C044)
高等学校博士学科点专项科研基金优先发展领域课题(20112302130005)
关键词
电子封装
软钎焊
无铅钎料
可靠性
electronic packaging
soldering
lead-free solder
reliability
