MCM倒装焊技术在CMOS-SEED灵巧象素中的应用研究

MCM Flip-chip-bonding Technique Used in Fabrication of CMOS-S EED Smart Pixel

介绍了新型 CMOS- SEED灵巧像素结构原理及相关的 MCM倒装焊混合集成技术 ,采用厚光致抗蚀剂作掩模 ,通过磁控溅射和真空蒸发相结合 ,研究了与 CMOS- SEED有关的 In凸点阵列成型、倒装焊、芯片间隙注入及子芯片衬底减薄或去除等关键工艺。

CMOS-SEED smart pixel and related M CM flip-chip-bonding technique is introduced.Using magnetic sputter and vacuum v aporation method with thick photoresist as mask,In-bump array manufacture,flip -chip-bonding process,fullfill between chips and removing or thinning of the s ubstrate for sub-chip related with CMOS-SEED was presented.