摘要
微电子技术的发展 ,推动着微电子封装技术的不断发展、封装形式的不断出新。介绍了微电子封装的基本功能与层次 ,微电子封装技术发展的三个阶段 ,并综述了微电子封装技术的历史、现状、发展及展望。
The development of microelectronics technology promotes the development of microelectronics packaging technology continuously, and new packaging forms appear time and again. In this paper, the basic functions and series of microelectronics packaging, the three stages of microelectronics packaging technology are introduced. And the history, the current state and the future trend of the microelectronics packaging technology are summarized.
关键词
微电子
集成电路
封装技术
microelectronics
integrated circuit
packaging technology
