氮化硅套圈内圆磨削及回归分析

Grinding and Regression Analysis of Silicon Nitride Ferrule Internal Surface

目的研究磨削工艺参数:砂轮的粒度、线速度(vs)、轴向振荡速(fa)和径向进给速度(fr)对氮化硅套圈内表面粗糙度的影响.方法采用树脂结合剂金刚石砂轮对氮化硅陶瓷套圈内圆进行单因素磨削加工实验,进行了4因素的正交实验.利用Taylor-Hobson Surtronic25型接触式粗糙度仪测量被磨工件表面粗糙度,通过回归分析得出了加工表面粗糙度的回归方程.结果随着砂轮粒度的减小,加工表面粗糙度由0.31μm下降到0.23μm.随着砂轮线速度的提高,被磨表面粗糙度由0.28μm升高到0.39μm,然后下降到0.33μm.砂轮轴向振荡速的提高,使被磨表面粗糙度波动变化.砂轮径向进给速度提高对加工表面粗糙度的影响不明显.结论明确了不同磨削参数对加工氮化硅陶瓷套圈内表面粗糙度的影响.利用正交实验法,将实验结果进行了回归分析,得出了氮化硅陶瓷套圈内表面粗糙度Ra的预测模型.

The influence of grinding process parameters which included grinding wheel granularity,line speed（vs）,axial oscillation speed（fa）and radial feedspeed（fr）on the roughness of silicon nitride ferrule internal surface was studied.With the resin bond diamond grinding wheel,the grinding single factor experiments which are on silicon nitride ceramic ferrule internal circle were performed.Orthogonal experiments of 4-factors had been finished.The surface roughness of grinded workpiece was measured by Taylor-Hobson Surtronic25 type contact roughness instrument.And the regression equation of the surface roughness can be obtained by regression analysis.With the decrease of the grinding wheel granularity,processed surface roughness decreases from 0.31 μm to 0.23 μm.With the increase of the wheel speed,the grinded surface roughness increases from 0.28 μm to 0.39 μm,then drops to 0.33 μm.With the increase of grinding wheel axial oscillation rate,the grinded surface roughness fluctuates.The influence on processed surface roughness caused by wheel radial feed speed improvement is not obvious.The influence of different grinding parameters on manufacturing silicon nitride ceramic ferrule internal circle is clear.The experimental regression analysis of the results is finished by using orthogonal experiment method.The prediction model of the silicon nitride ceramic ferrule internal circle roughness can be obtained.