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工作气压对直流磁控溅射Mo薄膜的影响 被引量:7

Effects of Working Pressure on Mo Films by Direct Current Magnetron Sputtering
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摘要 利用直流磁控溅射技术在单晶Si(110)基底上制备Mo薄膜,分析了工作气压对沉积速率、表面质量及微观结构的影响。结果表明:薄膜的沉积速率随压强的增大而增加;低气压下沉积的Mo薄膜表面质量较好且结构致密,高气压下沉积的Mo薄膜表面质量较差且结构疏松;在工作气压为0.8 Pa时,制备的Mo薄膜晶粒尺寸与微观应力值最小。 Mo films were successfully deposited by DC magnetron sputtering on Si substrates. The influences of deposition rate, surface tomograph and microstructure were analyzed. The results show that deposition rate increases with pressure. The film sputtered at low pressure has good crystallization and exhibites dense structure. Under high pressure conditions, the film exhibites bad crystallization and loose structure. At the pressure of 0.8 Pa, the film has lowest value of crysize and microstrain.
出处 《表面技术》 EI CAS CSCD 北大核心 2013年第1期71-74,共4页 Surface Technology
关键词 MO薄膜 直流磁控溅射 工作气压 晶粒尺寸 微观应力 molybdenum films direct current magnetron sputtering working pressure grain size microstrain
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