单多晶太阳能硅片切割线痕问题研究

Study On The Stria of Monocrystalline Silicon and Polycrystalline Silicon

线痕是多线切割领域比较常见的问题之一,分类总结了各种线痕产生的原因,并提出了相应的解决方法。

Stria is a common problem in the area of muti-wire cutting, classifying summarized the engendering reason of varied stria, and putting forward corresponding solution.