摘要
在Sn-0.7Cu-0.2Ni钎料中添加微量的Ag元素,测试了钎料的熔化温度、热膨胀性能、抗腐蚀性能及其润湿性。结果表明,添加微量的Ag元素降低了Sn-0.7Cu-0.2Ni的熔点,但增加了钎料的熔程。当Ag含量为0.3%(质量分数)时,钎料熔点为224.07℃,熔程为6.1℃。钎料的热膨胀系数随Ag含量的增加而升高。当Ag含量为0.3%(质量分数)时,钎料的热膨胀系数(20～100℃)为1.84×10-5/℃。另外添加Ag元素提高了钎料在HCl溶液中的抗腐蚀性能,同时也提高了钎料在Cu基板上的铺展面积。
Adding a small of Ag in Sn-0.7Cu-0.2Ni solder alloy,the melting temperature,thermal expansion coefficient,wetting properties and the corrosion resistant of Sn-0.7Cu-0.2Ni-xAg were measured.The results show that the trace amount of Ag can decrease the melting point of Sn-0.7Cu-0.2Ni alloy solder,but the melting range rasies as Ag was added.When the content of Ag was 0.3wt%,the melting point of Sn-Cu-Ni alloy solder was 224.07℃ and the melting range was 6.1℃.The coefficient of thermal expansion（CTE） increases with the content of Ag increasing.CTE of Sn-0.7Cu-0.2Ni-0.3Ag was 1.84×10-5/℃ from room temperature to 100℃.Meanwhile,the addition content of Ag can improve corrosion resistance of solder in HCl solution and effectively increase the spreading area of solder on the Cu substrate.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2013年第3期384-387,392,共5页
Journal of Functional Materials
基金
四川省非金属复合与功能材料重点验室-省部共建国家重点实验室培育基地开放基金资助项目(11zxfk24)
西南科技大学博士研究基金资助项目(10zx7113)
关键词
Sn-Cu-Ni
熔点
热膨胀系数
抗腐蚀性能
Sn-Cu-Ni
melting temperature
coefficient of thermal expansion（CTE）
corrosion resistance
wettability
