摘要
在分析BGA封装型FPGA焊点网络失效机理的基础上,提出一种焊点内建自测试(SJBIST)方法,用于对焊点网络失效的在线测试。结果表明:该原理实现的传感器能准确发现并报告不小于100Ω的高阻值失效,为FPGA面向应用的故障预测提供了一种可行的发展方向。
Based on analyzing physics of failure in solder-joint networks of FPGA with BGA packaging,a built-in self-testing(SJBIST)method for faults in solder joint networks was proposed.The test results show that this theory-supported sensor can accurately discover and report the high-resistivity faults not less than 100Ω.This provides a practical approach for the FPGA application-oriented failure prediction.
出处
《化工自动化及仪表》
CAS
2012年第8期1062-1065,共4页
Control and Instruments in Chemical Industry