基于高锰酸钾粗化及乙二醛化学镀铜的ABS塑料电镀工艺

Electroplating process for ABS plastics based on potassium permanganate roughening and electroless copper plating with glyoxal as reductant

开发了一种环保的ABS塑料电镀工艺，其流程主要为：去应力，碱性除油，粗化，氯化亚锡敏化，银氨活化，硼氢化钾还原，化学镀铜，硫酸盐电镀铜，苯并三氮唑钝化。采用高锰酸钾代替铬酸粗化ABS，以电镀层外观和结合力为性能指标，对粗化工艺进行优化。用乙二醛替代甲醛作化学镀的还原剂，研究了乙二醛的质量分数、pH、温度等对化学镀铜沉积速率的影响。粗化的最佳工艺为：高锰酸钾15g/L，温度45℃，时间50min。化学镀的最佳工艺为：乙二醛20％（质量分数），温度35℃，时间30min，pH13．0。

An environment-friendly plating process on ABS plastic substrate was developed. The process flow includes： stress removal, alkaline degreasing, roughening, stannous chloride sensitization, activation with silver-ammonia solution, reduction with potassium borohydride, electroless copper plating, copper plating in sulfate solution, and passivation with benzotriazole. Potassium permanganate was used to roughen the ABS plastic instead of chromic acid. The process parameters of roughening were optimized with the appearance and adhesion of coating as the performance indexes. Glyoxal was used as the reductant for electroless copper plating instead of formaldehyde. The effects of mass fraction of glyoxal, pH, and temperature on deposition rate of electroless copper plating were studied. The optimal process conditions are as follows： for coarsening, potassium permanganate 15 g/L, temperature 45 ℃, and time 50 min; and for electroless copper plating, glyoxal 20% （mass fraction）, temperature 35 ℃, pH 13.0, and time 30 min.