期刊文献+

玻璃基片上钽薄膜屈曲结构的边界效应研究

Edge Effect of Buckling Patterns in Ta films Deposited on Glass Substrates
下载PDF
导出
摘要 利用直流磁控溅射方法在玻璃基片上沉积了金属钽薄膜,研究了边界效应对薄膜屈曲结构的影响。结果表明:制备态的钽薄膜包含较大的残余压应力,促使薄膜与基片脱层而形成屈曲结构;屈曲结构在薄膜边界处成核生长,并逐渐扩展到薄膜内部区域;在薄膜边界处,屈曲结构呈垂直边界的平行直线状条纹结构,随着距离的增加,屈曲结构逐渐分叉形成无规网格结构或电话线结构。利用薄膜的单轴应力和等双轴应力模型,对屈曲结构边界处的形貌特征进行了深入分析。 Tantalum (Ta) films are prepared on glass substrates by direct current magnetron sputtering method, and the edge effect of buckling patterns is investigated. The results show that the as-prepared Ta film contains a large compressive stress, which is relieved by detaching of the film ~om its substrate. The buckling patterns nu- cleate at the film edges and then propagate into the central regions of the sample. In the vicinity of the film edge, they generally fnst have a straight-sided shape perpendicular to the edge, and then transform into bifurca- tion and buckle network or telephone cord structures. Based on the uniaxial and equl-biaxdal stress model, the v morphological characteristics of the buckling patterns near the film edges have been analyzed in detail
出处 《台州学院学报》 2012年第6期13-17,共5页 Journal of Taizhou University
基金 浙江省大学生科技创新项目(2011R409012) 国家自然科学基金(11074227 51271172) 浙江省自然科学基金(R6110362 Y1110700)
关键词 钽薄膜 屈曲 内应力 边界效应 Ta film Buckling Internal stress Edge effect
  • 相关文献

参考文献15

  • 1Bowden N, Brittain S, Evans A G et al. Spontaneous formation of ordered structures in thin films of metals supported on an elastomeric polymer [J] .Nature, 1998, 393: 146.
  • 2Cai S, Breid D, Crosby A Jet al. Periodic patterns and energy states of buckled films on compliant substrates [J]. J. Mech. Phys. Solids, 2011, 59: 1094.
  • 3Cai P G, Yu S J, Xu X Jet al. Growth mechanism and stress relief patterns of Ni films deposited on silicone oil surfaces[J]. Appl. Surf. Sci., 2009, 255: 8352.
  • 4Hutchinson J W, Thouless M D, Liniger E G. Growth and configurational stability of circular, buckling-driven film delaminations [J]. Acta Metall. Mater., 1992, 40: 295.
  • 5Coupeau C, Naud J F, Cleymaad F, et al. Atomic force microscopy of in situ deformed nickel thin films [J]. Thin Solid Films, 1999, 353: 194.
  • 6Abdallah A A, Bouten P C P, den Toonder J M J et al. Buckle initiation and delamination of patterned ITO layers on a polymer substrate [J] Surf. Coat. Technol., 2011, 205: 3103.
  • 7Moon M W, Jensen H M, Hutchinson J Wet al. The characterization of telephone cord buckling of compressed thin films on substrates [J]. J. Mech. Phys. Solids, 2002, 50: 2355.
  • 8Audoly B. Stability of straight delamination blisters [J]. Phys. Rev. Lett., 1999, 83: 4124.
  • 9Cordill M J, Bahr D F, Moody N R et al. Adhesion measurements using telephone cord buckles [J]. Mater. Sci. & Eng. A, 2007, 443: 150.
  • 10Lee A, Litteken C S, Dauskardt R H et a[ Comparison of the telephone cord delamination method for measuring interracial adhesion with the four-point bending method [J]. Acta Mater., 2005, 53: 609.

二级参考文献4

共引文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部