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交流阻抗测定化学镀镍的电化学机理 被引量：1

An Electrochemical Mechanism of Electroless Nickel Plating Based on AC Impedance Measurements
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摘要 采用交流阻抗技术对化学镀Ni-P合金的沉积过程进行原位测定,所获得的Nyquist阻抗图上出现感抗圈。综合交流抗击以及还原剂浓度影响研究结果,提出一个包括H_2PO_2^-离子表面吸附步骤的化学镀镍电化学机理。 The Model 368 system was used to measure the AC impedance of the process of electroless nickel plating. One inductive loop is found at low frequencies. A theoretical model including the step of adsorption of HaPO2-ions is established based on the AC impedance measurements.
作者 胡茂圃 栾本利
机构地区 北京科技大学表面科学与腐蚀工程系
出处 《北京科技大学学报》 EI CAS CSCD 北大核心 1991年第2期162-168,共7页 Journal of University of Science and Technology Beijing
关键词 交流阻抗 化学镀 电化学机理 镀镍 electroless nickel plating, electrochemical mechanism, AC impedance measurement
分类号 TQ153.12 [化学工程—电化学工业]
  • 相关文献

参考文献1

  • 1曹楚南，腐蚀电化学原理，1985年

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引证文献1

北京科技大学学报
1991年 第2期

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