摘要
介绍了一种基于低温共烧陶瓷工艺的新型高度集成毫米波无源接收前端,该前端由阵列天线、馈电网络和带通滤波器构成.上述无源器件以天线集成封装方式经过一体化设计,并应用于毫米波无线系统.首先,设计了2×2线极化空气腔阵列天线,通过采用新颖的内埋空气腔体结构,使天线最大增益提高了2.9 dB.其次,将具有双层谐振结构的三阶小型化发卡型带通滤波器和天线馈电网络进行一体化设计.该滤波器测试结果显示:插入损耗为1.9dB,3 dB相对带宽为8.1%(中心频率为34 GHz).最后将上述天线和滤波网络进行一体化设计,实现了三维无线接收前端.在集成结构中,通过采用金属柱栅栏抑制了寄生模式.测试结果显示天线最大增益可达14.3dB,通过集成滤波馈电网络,其阻抗带宽为2.8 GHz.该新型一体化集成前端系统具有良好的射频性能,可作为全集成无源前端应用于Ka波段无线系统中.
This paper demonstrates a novel highly integrated LTCC MMW passive receiving front-end which consists of an- tenna array, feed network and embedded band pass filter. The above passive components were co-designed as an antenna- in-package (AIP) solution for millimeter wave wireless system. Firstly, 2 × 2 linear patch antenna array with air cavity had been designed. Its maximum gain was increased 2.9dB by adopting a novel embedded air cavity. Secondly, a 3-pole minia- turized hairpin filter which was composed of three double layer resonators had been co-designed with the feed network. The filter exhibits an insertion loss of 1.9 dB and a 3 dB bandwidth about 8.1% at the center frequency of 34 GHz. Finally, the above antenna and filtering network were co-designed as a 3-D wireless receiving front-end. In the integrated structure, via fences were introduced to suppress parasitic modes. The measured maximum gain of the array antenna is 14.3dB and its impedance bandwidth ( VSWR 〈 2 ) is 2.8GHz (32.9 N 35.7 GHz)with the filtering feed network. The excellent overall per- formance of the novel array antenna shows great potential as a fully integrated passive front-end solution for a Ka-band wire- less system.
出处
《红外与毫米波学报》
SCIE
EI
CAS
CSCD
北大核心
2013年第1期6-12,共7页
Journal of Infrared and Millimeter Waves
基金
Supported by the National Program on Basic Researoh Project of China(Grant No.2010CB327505)
关键词
毫米波
立体集成被动前端系统
天线一体化集成封装
低温共烧陶瓷
高增益阵列天线
小型化带通
滤波器
millimeter-wave(MMW)
3-D integrated passive front-end system
antenna in package (AIP)
Low-tempera-ture co-fired ceramic (LTCC)
high gain array antenna
miniaturized bandpass filter