芯片产业化过程中所使用UV膜与蓝膜特性分析

Feature analysis of UV tape and blue tape used in chip industrialization

为了提高Wafer加工工艺质量,推动芯片产业化的目的,理论上对比了UV膜和蓝膜的特性,实践中分别使用UV膜和蓝膜加工Wafer并做倒封装摘片实验,得出小芯片减薄划切时应用UV膜对倒封装生产线具有优越性,可以提高芯片摘取效率,可以防止崩片。同时结合实验,得到UV膜在应用中出现的一些问题,并给出解决办法,最终测试结果符合预期的结果。

In order to improve the quality of wafer processing and promote the chip industrilization, the properties of UV tape and blue tape are contrasted theoretically. UV tape and blue tape were applied to the wafer fabrication respectively. An experiment of chip pick-up was implemented. When UV tape was used for grinding and wafer sawing, its superiority in the flip chip production was obtained. It can improve chip pick-up efficiency and prevent disintegration. UV tape＇s some problems existing in the pro- duction process are pointed out and the corresponding solutions are provided. Anyway, the test results meet the expected results.