摘要
探讨了氯化浸金体系下不同氧化剂对废手机电路板金浸提效果的影响。结果表明:盐酸-氯酸盐(或次氯酸盐)体系理论上可以有效提取金,但是氯化浸金过程较慢,加热、搅拌在提高浸金反应速度的同时也会造成浸金过程污染物排放,该浸金体系不利于以合金形式存在的金浸提,硝酸-盐酸体系下金的化学反应氧化电位与其相近,但金的浸提率高。
The effect of different oxidants in gold chlorination leaching system on gold leaching of waste printed circuit boards （PCBs） from mobile phones has been analyzed in this paper.The result indicated that theoretically hydrochloric acid-chlorite （or hypoehlorite） system could leach gold out of the PCBs effectively but the leaching process was relatively slow. Heating and stirring could increase the reaching rate while it would cause pollutants during gold leaching. Moreover, this kind of leaching system is not suitable for gold existed in form of alloy.Nitric acid-hydrochloric acid leaching system has an approximate oxidation potential to that of hydrochloric acid-chlorite （or hypochlorite） system in gold leaching but has a relatively better gold leaching efficiency.
出处
《中国资源综合利用》
2013年第1期38-41,共4页
China Resources Comprehensive Utilization
基金
中国环境科学院基金项目(2010GGQD11
2011GQ-20)
关键词
电子废弃物
手机
电路板
氯化浸金
waste electronica and electronic equipment （WEEE）
mobile phones
printed circuit boards （PCBs）
gold chlorination leaching
