摘要
采用粒径为10、25、40μm的金属Cu粉与平均粒度为3μm的W粉,通过伪半固态触变挤压铸造制备了W-40Cu合金筒形件。结果表明,在加热温度为1350℃、挤压力为500MPa的条件下,减小Cu粉粒径有利于触变挤压铸造成形件力学性能的提高;Cu粉粒径越细,成形件导电性能越好。
Thixo-die-forging process in pseudo-semi-solid state was used to prepare W-40Cu cup shell with copper particle size in 10 μm, 25 μm,40 μm and tungsten particle size in 3 μm. The results show that with the heating temperature of 1 350℃ and applied pressure of 500 MPa, the decrease of copper parti- cle size is favorable for the improvement of mechanical properties of thixoforged parts. With the copper particle size decrease, conductive properties of thixoforged parts are increased.
出处
《特种铸造及有色合金》
CAS
CSCD
北大核心
2013年第2期101-103,共3页
Special Casting & Nonferrous Alloys
基金
国家自然科学基金资助项目(51175018)