摘要
集成电路制造用溅射靶材的绑定技术,又称焊接或粘接技术,是溅射机台设计和制造工程师、溅射靶材开发生产工程师、以及集成电路制造工艺和设备工程师共同关心的问题,通过对比研究机械连接、钎焊、胶粘结、扩散焊、电子束焊和爆炸焊的应用条件和优缺点,增进溅射靶材设计、生产和使用相关工程师对靶材绑定技术的交流和认识。
Bonding technology of sputtering target for IC manufacturing process is a common topic to sputter tool designing and manufacturing engineers,sputtering targets developing and fabrication engineers,as well as IC manufacturing process and equipment engineers.Through contrasted research to the application condition,strongpoint and disadvantage for mechanical joint,solder bond,epoxy bond,diffusion bond,electron beam weld and as well as explosion weld,it is benefit to the knowledge of bonding technology of sputtering target among target designer,fabrication engineer and user.
出处
《金属功能材料》
CAS
2013年第1期48-53,共6页
Metallic Functional Materials
关键词
溅射靶材
钎焊
扩散焊
电子束焊
爆炸焊
sputtering target
solder bond
diffusion bond
electron beam weld
explosion weld
