基于红外热像技术的热阻测定方法研究

Study on thermal resistance measurement method base on infrared thermal imaging technology

采用已知热阻的标准板作为试件,用常见的热阻测定方法对标准板的热阻进行校核。然后探讨了红外热像技术测定试件热阻的原理并采用红外热像技术法对标准板热阻进行测定,通过结果对比分析,发现测定结果与标准板热阻较为符合,证明采用红外热像技术法对试件热阻的定量测定是完全可行的,为红外热像技术在复合材料热阻测定及墙体热阻的现场测定提供了依据。

This paper uses a normative board of known thermal resistance as the test piece. First of all, we use common thermal resistance measurement methods to check thermal resistance of the normative board. Then introduced the principle what the infrared thermal imaging technology for test thermal resistance and use the infrared thermal imaging technology determined the thermal resistance of the normative board, the result of determination is similar to the thermal resistance of the normative board. It proves that the infrared thermal imaging technology on the thermal resistance method for the quantificational determination is completely feasible. It provides further evidence for infrared imaging method in composite materials determination of thermal resistance and thermal resistance of wall material in situ determination