摘要
为了研究某种HTPB推进剂与衬层界面的失效过程,设计了小型粘接件并对其拉伸断裂过程进行了CCD光学显微镜观察,试验结果表明,紧贴衬层附近的高氯酸铵(AP)颗粒与衬层之间的脱湿,是影响该种推进剂与衬层界面粘接性能的主要因素,同时表明颗粒与衬层之间的界面能小于颗粒与基体之间的界面能。采用图像测量的方法,获得了裂纹平均宽度和平均脱湿长度(颗粒表面与基体之间空隙的长度)与夹具位移之比以及比值随夹具位移的变化率,并以之作为参数,分别在宏观和微观的角度定量分析了推进剂与衬层界面的粘接质量,可作为传统界面粘接质量评定方法的补充。
In order to study the failure behavior of HTPB propellant/liner interface,a kind of small specimen was designed and its fracture behavior under axial tensile was observed by using a CCD microscope.The relations of the average crack width and dewet length with the clamping fixture displacement were determined by using image measurement method,and the bonding quality of the interface was analyzed from the macroscopic and microscopic views.The experiment results show that the dewet of interface between the granulated AP close to liner and the liner is the main cause of the performance degradation,and the interface energy between AP and propellant binder is greater than that between AP and liner.It can be a supplement to the traditional way to assess the bonding quality of solid propellant and liner.
出处
《兵工学报》
EI
CAS
CSCD
北大核心
2013年第1期66-71,共6页
Acta Armamentarii
关键词
兵器科学与技术
界面
细观拉伸
脱湿
细观损伤
ordnance science and technology
interface
microscopic tensile
dewet
microscopic fracture