期刊文献+

微通道挤注药剂配方与装药工艺研究 被引量:3

Study on the Extrusion-cast Booster and Charging Process for the Small Grooved Channel
下载PDF
导出
摘要 针对起爆逻辑网络,探索采用奥克托今(HMX)基塑性粘结炸药作挤注型传爆药,运用分段挤压注入沟槽的工艺方式对直线微通道装药。通过正交试验研究了HMX粒度、Viton A含量、增塑剂种类及用量对装药与传爆性能的影响。结果表明,实验塑性炸药挤注工艺用于小尺寸传爆沟槽装药可行,装药致密、均匀;细化HMX含量为97%的传爆药不适于挤注装药;粘结剂低于3%时,挤注药体成型变差;增塑剂用C2与C3的塑性炸药表面更平滑,柔韧性更强;达到可传爆密度的前提下,HMX中小粒度颗粒维持相当含量是沟槽传爆药可靠传爆的必要条件;E级HMX 47.5%、细化HMX 47.5%、Viton A 5%、增塑剂C32%(外加)为最优挤注型传爆药装药配方,装药平均密度1.44 g/cm3,1 mm×1 mm沟槽内平均爆速达6 959 m/s,直线传爆临界直径0.5 mm。 For the logic initiation network, the HMX-based plastic explosive was made as an extrusion- cast booster and filled up into linear channel in the way of repeated sections. The charge and explosion performances were studied from the particle size of HMX, the content of Viton A, and the sorts of plasti- cizer through the orthogonal test. The test results show that the extrusion-cast process in the experiment is fit for charge for the small grooved channel. The charge is compact and uniform. 97 percent of fine HMX is not fit for the charge. The shaping of extrusion-cast booster becomes bad in the case of binder being lower than 3 percent. The plasticization effects of plasticizers C2 and C3 are better. Under the premise of high enough HMX density, fine HMX being at a certain proportion of the whole HMX is the key to relia- ble booster. The extrusion-cast booster composing of 47.5 percent of E HMX, 47.5 percent of fine HMX, 5 percent of Viton A and 2 percent of plasticizer C3 is the best formula. The charge density is 1.44 g/cm3. The average detonation velocity is 6 959 m/s in the grooved channel which is 1 mm x 1 mm of section size. The linear critical diameter is 0.5 mm.
出处 《兵工学报》 EI CAS CSCD 北大核心 2013年第2期251-256,共6页 Acta Armamentarii
关键词 爆炸力学 沟槽通道 塑性挤注型传爆药 挤注工艺 爆速 装药密度 临界直径 explosion mechanics grooved channel detonation velocity charge density critical diameter extrusion-cast booster extrusion cast technology
  • 相关文献

参考文献8

二级参考文献14

  • 1吴学易.双向压药工艺在传爆药柱生产中的应用[J].火工品,1996(4):7-12. 被引量:16
  • 2松全才 杨崇惠 等.炸药理论[M].北京:兵器工业出版社,1997.84-96.
  • 3任务正.火炸药技术现状与发展[M].北京:中国北方化学工业总公司,1995.196.
  • 4Leo de yong.Prediction of ignition transfer reliability in pyrotechnic systems using the varicomp technique[R].AD-A167430,1986.
  • 5Gibbs,T.Popolato.High explosive property data[M].California:University of California Press,1980.
  • 6Singh G,Felix S P,Soni P.Studies on energetic compounds part 28[J].Thermochimica Acta,2004(399):153-165.
  • 7Tompa A S,Boswell R F.Thermal stability of a plastic bonded explosive[J].Thermochimica Acta,2000(357):169-175.
  • 8Silvia D A. Explosive Circuits[P]. USP 3728965, 1973.
  • 9Silvia D A. Explosive Logic Resolver Network[P]. USP 5009162, 1991.
  • 10孙国祥.高分子混合炸药[M].北京:国防工业出版社,1984..

共引文献22

同被引文献16

引证文献3

二级引证文献4

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部