摘要
研讨用相控阵超声检测薄板焊缝时,用扇形(S)扫描背散射衍射法对裂纹表征和定量的独特性。突出相控阵超声分辨力改善的三大关键因素:(1)使用一定尺寸的声孔阑和适当聚焦;(2)使用压电复合材料制作的、具有短脉冲的阵列探头;(3)使用S扫描图像和动态回波显示。以上三因素的组合,能明显改进裂纹表征和端部信号的识别。给出了实验示例,验证了相控阵超声对裂纹检测的分辨力及其对裂纹准确定量的重要贡献。
This article discussed on the unique feature of phased array ultrasonic technology to charac- terizing and sizing cracks in inspection of thin welded joints by using Sectorial (S) scans and back-scattered tip diffraction technique. It was highlighted three key factors to improve defect resolution by using ultra- sonic phased arrays: (1) appropriate apertures and focusing; (2) highly damped piezo-eomposite arrays having shorter pulses; (3) S-scan imaging and S-scan echodynamic displays. The combination of the above three factors can obviously improve crack characterization and tip signal identification. Some experiment cases were given to demonstrate the crack resolving and accurate sizing capabilities of phased arrays
出处
《无损探伤》
2013年第1期1-8,共8页
Nondestructive Testing Technology
关键词
超声检测
相控阵
扇形(S)扫描
分辨力
裂纹表征
定量
Ultrasonic inspection
Phased array
Sectorial (S) scans
Resolution
CharacterizingCrack
Sizing