摘要
Because Fe has a more negative standard reduction potential than Ni, the simultaneous electroless deposition of Fe and Ni is difficult. In this study, Fe-42Ni（P） electroless deposit was prepared by using disodium ethylene diarnine tetraacetate （ETDA-2Na） as complexing agent to reduce the difference in the electrode potential between Ni2＋ and Fe2＋o The solderability and the interfacial reaction between Fe-42Ni（P） alloy and Sn were investigated. It was found that the electroless Fe-42Ni（P） alloy has excellent wettability with Sn. Moreover, the interfacial reaction rate between Fe-42Ni（P） and Sn is very slow. These results suggest that Fe-42Ni（P） alloy may become an attractive under-bump metallization （UBM）.
Because Fe has a more negative standard reduction potential than Ni, the simultaneous electroless deposition of Fe and Ni is difficult. In this study, Fe-42Ni（P） electroless deposit was prepared by using disodium ethylene diarnine tetraacetate （ETDA-2Na） as complexing agent to reduce the difference in the electrode potential between Ni2＋ and Fe2＋o The solderability and the interfacial reaction between Fe-42Ni（P） alloy and Sn were investigated. It was found that the electroless Fe-42Ni（P） alloy has excellent wettability with Sn. Moreover, the interfacial reaction rate between Fe-42Ni（P） and Sn is very slow. These results suggest that Fe-42Ni（P） alloy may become an attractive under-bump metallization （UBM）.
基金
supported by the National Basic Research Program of China (No. 2004CB619306)
the National Natural Science Foundation of China (Nos. 51171191 and 51101161)
the Major National Science and Technology Program of China (No. 2011ZX02602)
