基板金相结构对镀锡板锡层特性及其结合力的影响

Effects of Substrate Metallographic Structures on Tin Layer Peculiarity and Combining Force of Tinplate

采用金相显微镜、扫描电镜和电化学分析方法,研究了基板金相结构对镀锡板锡铁层特性和锡层结合力的影响。结果表明,晶粒细小的镀锡基板获取的镀锡层较为粗糙,且镀锡层存在明显的孔隙;随着镀锡基板晶粒的增大,镀锡层的孔隙减少,且镀层均匀致密;晶粒粗大的镀锡基板沉积锡层的自腐蚀电位明显大于晶粒细小的镀锡基板表面镀锡层;晶粒粗大的镀锡基板表面沉积锡层的结合力较好。

The effects of substrate metallographic structure on tin layer peculiarity and combining force of the tinplate were researched by optical microscope, scanning electron microscopy and electrochemical analysismethod. The results show that tin layer on fine substrate have rough surface and obvious pores. The tin layer becomes compact and its surface pores decrease with the substrate grain increasing. The corrosion potential oftin layer on substrate with bulky grain size is obviously higher than that on small grain size substrate. The combining force of the tin layer on substrate with bulky grain is much better.