温度对苯并噁嗪共混树脂介电性能的影响

Effect of Temperature on the Dielectric Properties of Polybenzoxazine Blend Resin

合成了对氨基苯炔丙基醚（appe）,与苯酚和多聚甲醛通过 Mannich 反应制备了含炔丙基的苯并噁嗪（P-appe）.将 P-appe 与苯酚/苯胺型苯并噁嗪（PAF）采用溶液共混的方法制得了共混苯并噁嗪树脂,研究了PAF和P-appe共混树脂的工艺性以及温度对其固化树脂介电性能的影响.结果表明：共混树脂粘度小于50 mPa·s,加工窗口为80~200℃.共混树脂凝胶过程的活化能为102.1 kJ/mol,固化树脂的吸水率低于0.44%.共混树脂的介电常数随温度升高而上升,介质损耗随频率的增加出现的峰值随温度上升而移向高频.固化树脂分子内氢键（-OH···N）含量随温度的升高而提高.

A p-aminophenyl propargyl ether（appe） was synthesized, and a propargyl based benzoxazine （P-appe） was prepared with the appe, phenol and paraformaldehyde by Mannich condensation reaction. A benzoxazine blend（PAF/P-appe） was prepared by blending the P-appe and phenol/aniline-based benzoxazine （PAF） in solution, and the processibility of the PAF and P-appe blend resin and the effect of tempera-ture on the dielectric properties of the cured resin were studied. The results show that the viscosity of the blend resin is lower than 50 mPa·s with the processing window at 80~200 ℃. The activity energy of the blend resin in gel process is 102.1 kJ/mol, and the water absorption of the cured resin is lower than 0.44%. With the increase of temperature, the dielectric constant of the cured resin increases, the peak tand of the cured resin shifts to higher frequency, and the content of intramolecular hydrogen bonding （-OH···N） in the cured resin increases.