氮气回焊炉内氧浓度气氛对焊接的影响

Effect of O_2 Concentration on Solder Joint in Nitrogen Reflow Oven

目前厂内氮气炉的焊接气氛均是通过自带的氧浓度仪表进行控制。随着专业在线测试回流焊炉内氧浓度设备的产生及应用,发现炉内实际情况与回流焊炉仪表的显示值相差悬殊。研究分别选择氧气体积分数3×10-3、7×10-3、10×10-3、15×10-3、45×10-3、80×10-3以及空气进行回流焊接,对比焊点的外观、气泡率、焊点强度以及界面IMC,最后发现不同氧气体积分数气氛对焊接品质无明显的影响。

Currently, each the reflow oven has one oxygen meter, so we control the oxygen concentration in the reflow oven depending on the displayed value. Accompanied by the generation and application of the professional online test equipment, we found that it is significant differences between the actual value and the reflow oven displayed by itself. We select seven oxygen concentration levels of 3 x 103, 7 X 10^-3, 10 x 10^-3, 15 x 10^-3, 45 x 10^-3, 80 x 10^-3 and air in this study. After contrasting with the appearance of the solder joints, the void rate, joint strength, and IMC, we found that there is no evident difference for 02 concentration varying.