摘要
为了提高聚酰亚胺(PI)胶粘剂的耐热性能,将碳硼烷引入PI分子链中,首次合成出一种新型含碳硼烷的PI单体,并采用红外光谱(FT-IR)法对其结构进行了表征。结果表明:含碳硼烷的PI单体在400～500℃升温过程中可交联固化;以此作为PI胶粘剂的基体,可赋予PI胶粘剂极佳的热稳定性能(500～1 300℃时热失重变化不大),从而为制备耐高温胶粘剂提供了新的途径和新的方法。
In order to improve the heat-resistance of polyimide （PI） adhesive, a new type PI monomer with carborane was first synthesized by the carborane introduced into PI molecular chain,and its structure was characterized by infrared spectroscopy（FT-IR）. The results showed that the PI monomer with carborane could becured by crosslinking in heating process of 400-500 ℃. When it was used as a matrix of PI adhesive,the PI adhesive had excellent thermal stability （slightly change in hot weight-loss at 500-1 300 ℃）. Thereby,a new route and new method for preparin adhesives with high temperature-resistance were offered.
出处
《中国胶粘剂》
CAS
北大核心
2013年第2期13-17,共5页
China Adhesives
关键词
碳硼烷
耐高温
聚酰亚胺
胶粘剂
carborane
high temperature-resistance
polyimide （PI）
adhesive
