期刊文献+

不同参数对复合毛细芯热柱传热性能的影响 被引量:1

Influence of different parameter on heat transfer performance for composite wick heat column
下载PDF
导出
摘要 针对高性能电子芯片散热存在的问题,研制了一种复合毛细芯热柱,设计了复合毛细芯热柱的结构及其毛细芯结构,研究了不同参数对复合毛细芯热柱的传热性能的影响。结果表明复合毛细芯热柱在3 s内达到了恒定温度,启动性能非常好;热柱的最大传热量为140 W,传热性能随热柱倾斜角度的增加而降低;随着铜纤维直径的增加而降低。铜纤维烧结层厚度过大过小对热柱的传热性能都不利,只有适中的铜纤维烧结层厚度,热柱的传热性能最好。 Composite wick heat column applied in dissipating high flux of microelectronic chip was de- veloped and its structure were designed. The influence of different parameter on its heat transfer perform- ance was investigated in test. The result shows that the composite wick heat column reached invariable tem- perature in 3s, which indicated it had good start-up performance. The composite wick heat column's maxi- mum heat transfer quantity is 140 W, the heat transfer performance decreases as the inclined angle increas- ing and increases as copper fiber diameter decreases. It is disadvantage for the heat transfer performance when the copper fiber sintering layer' s thickness is too large or little. Only when copper fiber diameter is moderate, it' s heat transfer performance is the best.
出处 《低温工程》 CAS CSCD 北大核心 2013年第1期60-64,共5页 Cryogenics
基金 国家自然科学基金项目(50930005) 广东省自然科学基金项目(U0834002)
关键词 复合毛细芯 热柱 传热性能 composite wick heat column heat transfer performance
  • 相关文献

参考文献6

  • 1Yazawa K, Bar-Cohen A. Energy efficient cooling of notebook comput- ers. 2002 Inter Society Conference on Thermal Phenomena, San Diego, CA Institute of Electrical and Electronics Engineering Inc, 2002,785- 791.
  • 2JM Y,Cho H,Kim M,et al. Micro cooling application on high density memory module. 19th IEEE EMI-THERM Symposium [ C ]. San Jose, CA Institute of Electrical and Electronics Engineering, 2003,179-184.
  • 3陶汉中,张红,庄骏.小型微槽道热管90°弯曲前后传热性能比较[J].宇航学报,2008,29(2):722-728. 被引量:12
  • 4嘉善华异电子热传科技有限公司.柱形热管及制造方法[P].中国,申请号:200510060428.6.
  • 5Tao Sulian,Tang Yong, Lu Longsheng, et al. Fabricationand experimen- tal study of heat column [ C ]. 2010 InternationalConferenee on Mechan- ic Automation and Control Engineering, Wuhan: IEEE, 2010: 3036- 3040.
  • 6陶素连,汤勇.热柱复合毛细芯的成形工艺及其优化[J].华南理工大学学报(自然科学版),2011,39(6):29-35. 被引量:6

二级参考文献19

  • 1陶汉中,张红,庄骏.小型微槽道热管90°弯曲前后传热性能比较[J].宇航学报,2008,29(2):722-728. 被引量:12
  • 2池勇,汤勇,陈锦昌,邓学雄,刘林,万珍平,刘晓晴.Forming process of cross-connected finned micro-grooves in copper strips[J].中国有色金属学会会刊:英文版,2007,17(2):267-272. 被引量:5
  • 3李勇,汤勇,肖博武,李西兵,曾志新.铜热管内壁微沟槽的高速充液旋压加工[J].华南理工大学学报(自然科学版),2007,35(3):1-5. 被引量:23
  • 4[3]McGlen R J,Jachuck R,Lin S.Integrated thermal management techniques for high power electronic devices[J].Applied Thermal Engineering,2004,24(8-9):1143-1156.
  • 5[4]Basiulis A,Hummel T A.The applications of heat pipe techniques to electronic component cooling[C].ASME Winter Annual Meeting,New York,1972.
  • 6[5]Edelstein F.Deployable heat pipe radiator[R].Final report,NASA Report,1975.
  • 7[6]Peeples M E and Calhoun L D.Fabrication and comparative performance of three variable conductance heat pipe concepts[C].ASME Paper,1977.
  • 8[7]Shaubach R M and Gernert N J.High performance flexible heat pipe[C].AIAA 20th Thermophysics Conference,Williamsburg,1985.
  • 9[11]Lin L C,Faghri A.Heat transfer in micro region of a rotating miniature heat pipe[J].International Journal of Heat and Mass Transfer,1999,42(8):1363-1369.
  • 10[12]Harris D K,Goldschmidt V W.An empirical investigation into the external heat transfer of a U-bend in cross-flow[J].International Journal of Heat and Mass Transfer,1999(42):1957-1968.

共引文献16

同被引文献2

引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部