摘要
采用硅含量为3.5%的无取向硅钢作为渗硼基体,通过熔盐电化学的方法渗硼,以改善硅钢磁性和塑性。利用辉光放电光谱仪、原子力显微镜和X射线衍射仪,研究熔盐电化学渗硼过程中,电流密度对渗层的成分、表面形貌、截面形貌和表面物相的影响,从而确定最佳工艺条件。结果表明:当沉积时间60 min,温度为800℃,占空比20%,周期1 000μs,电流密度为50 mA/cm2时,渗层的厚度最大;渗层表面粗糙度最小,表面光洁度最好;渗层组织最为细致紧密。
The non - oriented silicon steel with silicon content of 3.5% is used as base body to be boronised with molten - salt electrochemical boriding process to improve magnetism and plasticity of silicon steel. With help of glow discharge spectrometer, atomic force microscope and x - ray diffractometer, it is researched the influence of current density on composition of penetrating layer, surface morphology, section morphology and surface phase in boriding process to determine the best process conditions. It is showed that under condi- tions of sedimentation time being 60 minutes, temperature 800 ℃, duty ratio 20% , circle period 1 000 μs and current density as 50 mA/cm2 , the thickness of penetrating layer is largest, surface roughness smallest, surface finish best, and structure most fine and close.
出处
《河北冶金》
2013年第2期14-18,共5页
Hebei Metallurgy
关键词
渗硼
熔盐电化学
电流密度
boriding
molten - salt electrochemistry
current density
