摘要
本文在结合了不流胶粘结片技术和高导热填料技术研究的基础上,开发出了综合性能优良的高导热不流胶粘结片,可适用于有导热要求的刚挠结合板等应用领域。
Highly thermal conductive no flow prepreg was developed on the basis of research on no flow technology and high thermal conductive technology. The Highly thermal conductive no flow prepreg can be used in the area of rigid-flexible printed circuit board with thermal conductive requirements.
出处
《覆铜板资讯》
2013年第1期25-26,20,共3页
Copper Clad Laminate Information
关键词
高导热
不流胶
粘结片
刚挠结合PCB
high thermal conductive, no flow, prepreg, rigid-flexible PCB
