摘要
新型化学镀铜液比常规工艺具有溶液稳定、易操作和成本低廉等优点,取消了原为光亮镀铜工序打底的镀镍工艺,减轻了工人的劳动强度,节约了能源,为化学镀铜领域创出一条新路。
The new type of chemical Cu-plating solution is more stable than the conventional technology, easier to be operated.In addition, the cost is lower.All these decrease the labour strength of the workers and save energy, which reveals a new start in chemical Cu-plating field.
出处
《表面技术》
EI
CAS
CSCD
1991年第1期24-25,16,共3页
Surface Technology