基于设计数据共享的板级热仿真技术研究

Research on Thermal Simulation at PCB Level Based on Design Data Share

文中通过分析目前电子设备板级热仿真建模技术存在的不足,基于设计数据共享技术,系统研究了PCB板卡的叠层铜分布和热过孔仿真建模对芯片温度预测精度带来的较大影响,并结合实际应用给出了仿真优化算例。多组仿真算例的数据对比和优化分析表明,兼顾仿真精度与计算效率的板级热仿真技术可以较精确地预测芯片的结温和壳温,为系统级热仿真提供更为准确的局部环境。

Due to the insufficiency of thermal simulation at PCB level of electromc eqmpment at present, a systematic research was carried out, based on the design data share, on the influence of modeling of Cu distri- bution and thermal vias on PCB layers on the prediction accuracy of chip temperature. Study cases combined with actual application are introduced, too. Result comparison and optimization analysis of several cases show that the thermal simulation technology at PCB level with accuracy and efficiency can give the accurate predic- tion of case and junction temperature of chips. This research can also provide reliable thermal simulation re- suits of local environment at the system level.