镍-金刚石复合电镀的研究

Researches on the Compound Electroplating of Nickel-diamond

报导镍-金刚石复合电镀的实验研究结果。实验表明,采用电流密度为2～2.5A/dm^2、温度为45～50℃、pH值为2.8～3.2,搅拌镀液15～20秒停3～4分钟,可获得金刚石微粒含量为8～9Wt％的优质复合镀层;在镀液配方、pH值不变的情况下,电流密度、温度和搅拌间歇时间是影响镀层机械物理性能的主要因素。

This paper relates the experimental researches on the compound plating of nickel-diamond, which shows that excellent compound plating with a diamond particle content of 8 to 9 Wt% can be obtained by means of stiring the plating solution for 15 to 20 min. at the interval of 3 to 4 min. under the conditions of current density of 2 to 2.5A/dm^2, temperature at 45 to 50℃ and pH about 2.8 to 3.2. The current density,temperature and stirring time or interval time are the important factors influncing the mechanical and physical properties of the plating.