摘要
对先进封装步进投影光刻机的焦深进行评估。投影光刻机是IC制造与先进封装行业的关键设备,对后道封装而言,厚胶工艺是典型工艺,最厚部分可达0.1 mm以上,大焦深能够保证光刻机容纳各种工艺误差,能够保证封装光刻机用于曝光厚光刻胶时仍拥有较好的侧壁陡度。
The DOF of stepper exposure tool is evaluated. Stepper exposure tool is one of the key equipment of IC manufactory and advaced package. Large DOF will cover process error and the stepper could be used for exposuring thicker photo resist.
出处
《电子工业专用设备》
2013年第2期21-24,54,共5页
Equipment for Electronic Products Manufacturing
关键词
投影光刻机
焦深
分辨率
Stepper exposure tool
Depth of Focus（DOF）
Resolution
