摘要
在CMP设备中,大盘的整体性能直接影响抛光后晶圆的表面质量和整体面型精度。分析了三种大盘的受力结构,选择应用交叉圆锥滚子轴承的结构为最优。给出了抛光大盘的陶瓷台面的温度控制水道的三个分布模式。
In the CMP device, the main table＇s performance direct influence the surface quality and the overall surface precision of the polished wafer. Analysis three structures of the main table, Select the structure which use the crossed roller bearing for optimal. List three water channel patters for the temperature control of the ceramic table.
出处
《电子工业专用设备》
2013年第2期33-37,共5页
Equipment for Electronic Products Manufacturing
基金
国家02重大专项(项目编号:2009ZX02011-005A)
关键词
表面跳动
水压
温度
轴向跳动
Surface runout
hydraulic pressure
Temperature
Axis runout
