摘要
随着电子产品小型化、高集成度的发展趋势,电子产品的封装技术正逐步迈入微电子封装时代。本文对微电子封装的关键技术进行了介绍,介绍了芯片互连工艺、典型封装技术和MCM技术。同时,本文对微电子封装技术的发展趋势及应用前景进行了综述。
With the development trend of the miniaturization and high integration degree of electronic products, the packaging technol-ogy is gradually experiencing a microelectronic era. This article introduces the key technologies of microelectronics packaging such as the chips interconnect technology, typical packaging and MCM. It also reviews the development trends and application prospects of microelectronics packaging technology.
出处
《北华航天工业学院学报》
CAS
2013年第1期34-37,共4页
Journal of North China Institute of Aerospace Engineering
基金
河北省青年基金项目(Q2012149)
关键词
微电子封装
芯片互连技术
MCM
发展趋势
microelectronic packaging
chip interconnect technology
MC M
development trends
