摘要
高温压力传感器,在航空航天及工业领域有广阔的应用前景。由于工作在高温环境中,需要进行封装结构和优化,以减小器件因热膨胀系数不匹配而产生的热应力。以热机械方程为理论基础,利用ANSYS Workbench计算机仿真工具,通过计算被封装元件表面的Von-Mises应力,调整衬底直径、衬底厚度以及粘合层厚度,对封装结构进行优化实验,结果表明,采用优化后的封装结构,传感器工作于500℃时,敏感元件中心应力值减小为原来的0.37%,器件的稳定性得到大幅提高。
High temperature pressure sensor has wide prospect of applications in aerospace and industrial field. Since it works at high temperature, the structure of package needs to be analyzed and optimized to reduce the thermal stress caused by the mismatch of the CTE. This article based on the thermo-mechanical equation, used ANSYS Workbench computer simulation tool to calculate the Von-Mises stress of the surface of the component, and adjusted the substrate diameter, substrate thickness and the thickness of the bonding layer, to optimize the package structure. The result shows that by using the optimized structure, the stress of sensitive element center can be reduced by 0. 37% of the original, and the stability of the device is vastly improved.
出处
《计算机仿真》
CSCD
北大核心
2013年第3期92-96,共5页
Computer Simulation
关键词
高温压力传感器
热应力
结构优化
计算机仿真
High temperature pressure sensor
Thermal stress
Structural optimization
Computer simulation
