摘要
介绍了电感耦合等离子(ICP)刻蚀系统的刻蚀原理,分析了电感耦合等离子刻蚀系统在刻蚀晶圆的过程中遇到的刻蚀速率和刻蚀均匀性等方面的问题,具体分析了刻蚀速率和刻蚀均匀性的影响因素。同时,描述了设备在使用过程中经常遇到的一些故障现象,对这些故障现象发生的原因进行了详细地分析,根据分析的结果给出了故障的具体解决办法。最后,对电感耦合等离子刻蚀系统在日常使用过程中的保养和维护提出了一些建议,注重日常的保养和维护可大大降低设备的故障率。
The principle of the inductive couple plasma （ICP） etching system was introduced, some situations about etching rate and etching uniformity that appeared during etching wafers by the inductive couple plasma etching system were analyzed and the influencing factors of the etching rate and etching uniformity were analyzed. At the same time, some phenomena of trouble when using the equipments were described, then the reasons of trouble were analyzed. Based on the results, the solutions of trouble were provided. Finally, during daily use of inductive couple plasma etching system, some suggestions about maintenance were giving, laying stress on daily maintenance can greatly reduce fault rate.
出处
《半导体技术》
CAS
CSCD
北大核心
2013年第3期235-238,共4页
Semiconductor Technology
关键词
电感耦合等离子
晶圆
刻蚀速率
刻蚀均匀性
故障率
inductive couple plasma （ICP）
wafer
etching rate
etching uniformity
fault rate
